TW_感測器研發_Packaging Development Engineer (MEMS products)

Bosch Global Software (BGSW)•Taipei, , Taiwan•Hybrid
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About the Role

ResponsibilitiesDefine & drive milestones: Establish major package‐development milestones and ensure on-time delivery through proactive planning, progress tracking, and risk mitigation.Design coordination: Coordinate package design and process development for electronic MEMS sensors in collaboration with internal engineering teams and external suppliers.Process engineering: Develop and optimize assembly processes for MEMS in automotive and consumer-electronics applications.Sample build & qualification: Oversee sample manufacturing and process qualification at assembly partners.Cross-functional collaboration: Communicate and work effectively in English with international stakeholders across product engineering, supply chain, and quality teams.Experience: 3–8 years in semiconductor packaging/assembly (LGA, BGA, DFN, WLCSP).Technical expertise: Strong background in semiconductor assembly technologies and materials.Project management: Proven ability in milestone tracking, reporting, systematic problem solving, multi-task handling and customer communication.Global teamwork: Demonstrated success in multicultural, international projects.Adaptability: Agile in adjusting project plans to evolving technical requirements and customer needs.Language & mobility: Excellent English skills (verbal and written); willingness to travel as required.